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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/16/1988
Application #:
06871869
Filing Dt:
06/09/1986
Inventors:
TUNG PHAM NGU, JEAN CHEVRIER
Title:
METHOD OF FORMING AT LEAST TWO METALLIZATIONS OF A SEMICONDUCTOR COMPONENT, COVERED WITH A DIELECTRIC LAYER
Assignment: 1
Reel/Frame:
004782/0657Recorded: 11/10/1987Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
05/07/1986
Exec Dt:
05/07/1986
Assignee:
173, BL. HAUSSMANN
75008 PARIS, FRANCE
Correspondent:
OBLON, FISHER, SPIVAK, MC CLELLAND
& MAIER, CRYSTAL SQUARE FIVE, STE. 400
1755 SOUTH JEFF. DAVIS HWY.
ARLINGTON, VA 22202

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