Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/28/1988
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Application #:
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06876801
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Filing Dt:
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06/20/1986
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Inventors:
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DENVER BRADEN, DONALD A. BISTLINE
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Title:
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METHOD OF AND APPARATUS FOR PACKAGING CHIP COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 13900 N.W. SCIENCE PARK DRIVE |
| PORTLAND, OREGON 97229 |
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| JOHN J. MURPHEY |
| 3142 VISTA WAY, SUITE 400 |
| OCEANSIDE, CA 92056-3608 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 13900 N.W. SCIENCE PARK DRIVE |
| PORTLAND, OREGON 97229 |
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| JOHN J. MURPHEY |
| 3142 VISTA WAY, SUITE 400 |
| OCEANSIDE, CA 92056-3608 |
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