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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/12/1988
Application #:
07064839
Filing Dt:
06/19/1987
Inventor:
TOSHIYUKI TAKEDA
Title:
HIGHLY ELECTRICALLY CONDUCTIVE FILAMENT AND A PROCESS FOR PREPARATION THEREOF
Assignment: 1
Reel/Frame:
004828/0581Recorded: 03/07/1988Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
01/07/1988
Assignee:
2, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU
TOKYO 103, JAPAN
Correspondent:
MILLER & QUINN
1125 LAND TITLE BUILDING
PHILADELPHIA, PA 19110

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