Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/1989
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Application #:
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07073557
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Filing Dt:
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07/15/1987
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Inventors:
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JAMES HAYWARD, CANDICE H. BROWN
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Title:
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INTEGRATED CIRCUIT LEAD FRAME ASSEMBLY CONTAINING VOLTAGE BUSSING AND DISTRIBUTION TO AN INTEGRATED CIRCUIT DIE USING TAPE AUTOMATED BONDING WITH TWO METAL LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 901 THOMPSON PLACE |
| P.O. BOX 3453 |
| SUNNYVALE, CALIFORNIA 94088 |
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| ADVANCED MICRO DEVICES, INC. |
| ATTN: PATRICK T. KING, MS/68 |
| 901 THOMPSON PLACE |
| P.O. BOX 3453 |
| SUNNYVALE, CA 94088 |
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