Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/1989
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Application #:
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07156571
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Filing Dt:
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02/17/1988
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Inventors:
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YASUHIRO TERAOKA, TETSUYA UEDA, HIDEYA YAGOURA, HARUO SHIMAMOTO, SHIGEYUKI NANGO et al
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Title:
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PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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| LEYDIG, VOIT & MAYER |
| STE. 520, 655 FIFTEENTH ST., N. W. |
| WASHINGTON, DC 20005 |
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