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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/31/1989
Application #:
07269688
Filing Dt:
11/10/1988
Inventors:
TOSHIAKI OGAWA, NOBUO FUJIWARA, KENJI KAWAI, TERUO SHIBANO, HIROSHI MORITA et al
Title:
SEMICONDUCTOR WAFER TREATING APPARATUS UTILIZING A PLASMA
Assignment: 1
Reel/Frame:
004972/0176Recorded: 11/10/1988Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
09/05/1988
Exec Dt:
09/05/1988
Exec Dt:
09/05/1988
Exec Dt:
09/05/1988
Exec Dt:
09/05/1988
Exec Dt:
09/05/1988
Assignee:
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
LEYDIG, VOIT & MAYER
655 FIFTEENTH STREET, N.W.
SUITE 520
WASHINGTON, DC 20005

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