Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/1989
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Application #:
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07110927
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Filing Dt:
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10/21/1987
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Inventors:
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ABRAHAM M. HOLTZMAN, JOSEPH RELIS
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Title:
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USE OF IMMERSION TIN AND TIN ALLOYS AS A BONDING MEDIUM FOR MULTILAYER CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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PO BOX 6299 |
40 INDUSTRIAL PARK DRIVE |
WEST FRANKLIN, NEW HAMPSHIRE 03235 |
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MINTZ, LEVIN, COHN ET AL. |
A. JASON MIRABITO, ESQ. |
ONE FINANCIAL CENTER |
BOSTON, MA 02111 |
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