Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/28/1989
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Application #:
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07286460
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Filing Dt:
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12/19/1988
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Inventors:
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ULRICH M. GOESELE, REINHARD J. STENGL
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Title:
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METHOD FOR BUBBLE-FREE BONDING OF SILICON WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| A NON-PROFIT ORGANIZATION |
| DURHAM, NORTH CAROLINA |
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| RICHARD E. JENKINS |
| 200 SOUTH SQUARE CORPORATE CENTRE II |
| 3708 MAYFAIR STREET |
| DURHAM, NC 27707 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 3008 EUBANKS ROAD |
| DURHAM, NORTH CAROLINA 27707 |
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| BERGSTR. 3 D-8901 STADTBERGEN, GERMANY |
| DURHAM, NORTH CAROLINA 27707 |
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| ULRICH M. GOESELE |
| 3008 EUBANKS ROAD |
| DURHAM, NC 27707 |
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