Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/20/1990
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Application #:
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07312715
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Filing Dt:
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02/21/1989
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Inventor:
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YATSUHARU YOKOTA
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Title:
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REFLOW SOLDERING METHOD AND THE APPARATUS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 323-7 DAIRAKUJI-MACHI, HACHIOJI-SHI, |
| TOKYO, JAPAN |
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| ROBERT F. ZIEMS |
| 6862 ELM STREET |
| POST OFFICE BOX 1055 |
| MC LEAN, VA 22101 |
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