Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/22/1990
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Application #:
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07316633
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Filing Dt:
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02/28/1989
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Inventor:
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HIROSHI OKUDA
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Title:
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SEMICONDUCTOR SUBSTRATE COMPRISING WAFER SUBSTRATE AND COMPOUND SEMICONDUCTOR LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 1015, KAMIKODANAKA, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA 211, JAPAN |
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| ARMSTRONG, NIKAIDO, MARMELSTEIN, |
| KUBOVCIK & MURRAY |
| STE. 912, 1725 K ST., N.W. |
| WASHINGTON, DC 20006 |
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