Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/1990
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Application #:
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07171770
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Filing Dt:
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03/22/1988
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Inventors:
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TAKAJI TAKENAKA, TOSITADA NETSU, HIDETAKA SHIGI, MASAKAZU YAMAMOTO
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Title:
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MULTI-CHIP MODULE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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6, KANDA SURUGADAI 4-CHOME |
CHIYODA-KU |
TOKYO, JAPAN |
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FAY, SHARPE, BEALL, FAGAN, MINNICH AND |
MC KEE |
400 NATIONAL CITY |
EAST SIXTH BLDG., |
CLEVELAND, OH 44114 |
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