Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/19/1990
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Application #:
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07161097
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Filing Dt:
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02/26/1988
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Inventors:
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AKIO NAKAGAWA, KAORU IMAMURA, RYO SATO, TADAHIDE HOSHI
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING SUBSTRTRATE BONDING AND OUTDIFFUSION BY THERMAL HEATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 72 HORIKAWA-CHO, SAIWAI |
| A CORP. OF JAPAN |
| KAWASAKI-SHI, JAPAN |
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| OBLON, FISHER, SPIVAK, MC CLELLAND |
| & MAIER, CRYSTAL SQUARE FIVE - SUITE 400 |
| 1755 SOUTH JEFF DAVIS HWY., |
| ARLINGTON, VA 22202 |
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