Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/19/1990
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Application #:
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07234952
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Filing Dt:
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08/22/1988
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Inventors:
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NOBUYUKI YAGI, JIROH INAGAKI, KOZO MORITA, YASUTOSHI KAKU, NOBUYUKI KIKUCHI et al
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Title:
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MOLDED RESIN CASING OF ELECTRONIC PART INCORPORATING FLEXIBLE BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 335, KARIYADO, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA-KEN, JAPAN |
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| WENDEROTH, LIND & PONACK |
| SOUTHERN BLG. STE. 700 |
| 805 FIFTEENTH ST., N. W. |
| WASHINGTON, DC 20005 |
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