Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/14/1990
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Application #:
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06486464
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Filing Dt:
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04/19/1983
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Inventor:
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MITSUO SEKIYA
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Title:
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METHOD FOR GRINDING THE SURFACE OF A SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 20-10 SHIBA 5-CHOME, MINATO-KU |
| A CORP. OF JAPAN |
| TOKYO, JAPAN |
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| BEVERIDGE, DE GRANDI, KLINE & LUNSFORD |
| STE. 1100, FED. BAR BLDG. W. |
| 1819 H ST., N.W. |
| WASHINGTON, DC 20006 |
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