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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/25/1990
Application #:
07200894
Filing Dt:
06/01/1988
Inventors:
KOUICHI KUNIMUNE, YOSHIYA KUTSUZAWA, SHIRO KONOTSUNE
Title:
PROCESSES FOR PRODUCING A LOW THERMALLY EXPANSIVE AND HIGHLY ADHESIVE SILICON-CONTAINING POLYIMIDE AND A PRECURSOR THEREOF
Assignment: 1
Reel/Frame:
004923/0795Recorded: 06/01/1988Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
05/23/1988
Exec Dt:
05/23/1988
Exec Dt:
05/23/1988
Assignee:
6-32, NAKANOSHIMA 3-CHOME, KITAKU
OSAKA, JAPAN
Correspondent:
FRED PHILPITT
STE. 702
2001 JEFF DAVIS HWY.
ARLINGTON, VA 22202

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