Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/30/1990
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Application #:
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07333414
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Filing Dt:
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04/05/1989
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Inventor:
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SATOSHI AKUTAGAWA
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Title:
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PROCESS FOR FORMING DICING LINES ON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| STAAS AND HALSEY |
| 1825 K STREET NW |
| SUITE 816 |
| WASHINGTON, DC 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO 163-0722, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: H. J. STAAS |
| 1201 NEW YORK AVE., N.W., 7TH FLOOR |
| WASHINGTON, D.C. 20005 |
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