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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/11/1990
Application #:
07327538
Filing Dt:
03/23/1989
Inventors:
KAZUYUKI SAWADA, HISASHI OGAWA, KOHSAKU YANO, TSUTOMU FUJITA
Title:
METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE BY FILLING HOLLOWS WITH THERMALLY DECOMPOSED DOPED AND UNDOPED POLYSILICON
Assignment: 1
Reel/Frame:
005084/0965Recorded: 05/23/1989Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
04/24/1989
Exec Dt:
04/24/1989
Exec Dt:
04/24/1989
Exec Dt:
04/24/1989
Assignee:
1006, OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN
Correspondent:
STEVENS, DAVIS, MILLER & MOSHER
515 NORTH WASHINGTON ST.
P. O. BOX 1427
ALEXANDRIA, VA 22313-1427

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