Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/1991
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Application #:
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07421756
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Filing Dt:
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10/16/1989
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Inventors:
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MASAMI NAKANO, TAKAO ABE
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Title:
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METHOD OF INSPECTING BONDED WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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4-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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CHRIS COMMUNTZIS |
CUSHMAN, DARBY AND CUSHMAN |
11TH FLOOR 1615 L ST., N.W. |
WASHINGTON, DC 20036-5601 |
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