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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/23/1991
Application #:
07212944
Filing Dt:
06/28/1988
Inventors:
AKIRA SASAME, HITOYUKI SAKANOUE, HISAO TAKEUCHI, MASAYA MIYAKE, AKIRA YAMAKAWA et al
Title:
CONNECTION STRUCTURE BETWEEN COMPONENTS FOR SEMICONDUCTOR APPARATUS
Assignment: 1
Reel/Frame:
005552/0916Recorded: 01/02/1991Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
06/12/1988
Exec Dt:
06/12/1988
Exec Dt:
06/12/1988
Exec Dt:
06/12/1988
Exec Dt:
06/12/1988
Exec Dt:
06/12/1988
Exec Dt:
06/12/1988
Assignee:
15 KITAHAMA 5-CHOME, HIGASHI-KU
OSAKA, JAPAN
Correspondent:
W. G. FASSE
INDIAN POND LANE
P.O. BOX K
ST. ALBANS, ME 04971

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