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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/07/1991
Application #:
07465861
Filing Dt:
01/16/1990
Inventors:
YONENORI HAMADA, EIJI SENBOKUYA
Title:
BIMETALLIC CIRCUIT BREAKER WITH INSULATED THERMAL ASSEMBLY
Assignment: 1
Reel/Frame:
005556/0827Recorded: 01/04/1991Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
12/04/1989
Exec Dt:
12/04/1989
Assignees:
NO. 1760, HIGASHIMATANO-CHO, TOTSUKA-KU
YOKOHAMA-CITY, KANAGAWA-PREFECTURE, JAPAN
NO. 41, HIGASHIMATANO-CHO, TOTSUKA-KU
YOKOHAMA-CITY, KANAGAWA-PREFECTURE, JAPAN
Correspondent:
SUGHRUE, MION, ZINN,
MACPEAK & SEAS
2100 PENNSYLVANIA AVENUE, N.W.
WASHINGTON, D.C. 20237-3202

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