Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/1991
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Application #:
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07331809
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Filing Dt:
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04/03/1989
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Inventor:
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HIDEYUKI MIYAZAWA
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES INCLUDING UPDIFFUSION TO SELECTIVELY DOPE A SILICON LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| ANTONELLI, TERRY & WANDS |
| SUITE 600 |
| 1919 PENN AVE., N. W. |
| WASHINGTON, DC 20006 |
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