Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/28/1991
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Application #:
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07329478
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Filing Dt:
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03/28/1989
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Inventors:
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ROBERT J. WOJNAROWSKI, CHARLES W. EICHELBERGER
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Title:
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DIE ATTACHMENT METHOD USING NONCONDUCTIVE ADHESIVE FOR USE IN HIGH DENSITY INTERCONNECTED ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| GENERAL ELECTRIC COMPANY |
| CRD PATENT DOCKET RM 4A59 |
| P.O. BOX 8, BUILDING K-1 - SALAMONE |
| SCHENECTADY, NY 12301 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1501 WILSON BLVD., SUITE 805 |
| ARLINGTON, VIRGINIA 22209 |
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| SAMUEL B. SMITH, JR. |
| 1501 WILSON BLVD., #805 |
| ARLINGTON, VA 22209 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| GAY CHIN |
| MARTIN MARIETTA CORPORATION |
| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MD 20817 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| LOCKHEED MARTIN CORPORATION |
| JOHN J. MORRISSEY |
| 6801 ROCKLEDGE DRIVE |
| MAIL POINT 237 |
| BETHESDA, MD 20817 |
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