Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/1991
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Application #:
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07406548
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Filing Dt:
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09/13/1989
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Inventors:
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NOBUO OWADA, KAORU OOGAYA, TOHRU KOBAYASHI, MIKINORI KAWAJI
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE IN WHICH A SEMICONDUCTOR CHIP IS MOUNTED WITH SOLDER BUMPS FOR MOUNTING TO A WIRING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| ANTONELLI, TERRY & WANDS |
| 1919 PENN. AVE., N. W., STE. 600 |
| WASHINGTON, DC 20006 |
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