Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/23/1991
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Application #:
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07523149
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Filing Dt:
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05/14/1990
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Inventor:
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JOHN C. MATHER
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Title:
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PACKAGE STRUCTURE FOR MULTICHIP MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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JOHN J. HORN |
ROCKWELL INTERNATIONAL CORPORATION |
PATENT DEPARTMENT M/S 175-100 |
400 COLLINS ROAD N.E. |
CEDAR RAPIDS, IA 52498 |
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