Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/1991
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Application #:
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07456659
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Filing Dt:
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12/29/1989
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Inventors:
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KOJI KONDO, SEIJI AMAKUSA, KATUHIKO MURAKAWA, KATSUAKI KOJIMA, NOBUMASA ISHIDA et al
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Title:
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ELECTROLESS COPPER PLATING SOLUTION AND PROCESS FOR FORMATION OF COPPER FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 1-1 SHOWA-CHO KARIYA-CITY |
| AICHI-PREF., JAPAN 448 |
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| CUSHMAN, DARBY & CUSHMAN |
| 1615 L STREET, N.W., 11TH FLR. |
| WASHINGTON, DC 20036-5601 |
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