Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/01/1991
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Application #:
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07546313
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Filing Dt:
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07/03/1990
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Inventors:
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YOSHIHIKO MATUMOTO, HISANOBU TAKAHAMA
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Title:
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RESIN SEALING APPARATUS FOR USE IN MANUFACTURING A RESIN-SEALED SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 72 HORIKAWA-CHO, SAIWAI-KU, |
| KAWASAKI-SHI, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, |
| GARRETT & DUNNER |
| 1300 I STREET, NW |
| WASHINGTON, DC 20005-3315 |
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