Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/1991
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Application #:
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07405533
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Filing Dt:
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09/12/1989
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Inventors:
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KEN UCHIDA, MICHIYA HIGASHI, NAOKO KIHARA, HIROSHI SHIMOZAWA, AKIRA YOSHIZUMI
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Title:
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SEMICONDUCTOR DEVICE ENCAPSULANT CONSISTING OF EPOXY RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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72 HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, A CORP. OF JAPAN |
JAPAN |
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OBLON, SPIVAK, MC CLELLAND, MAIER & |
NEUSTADT, FOURTH FLR. |
1755 JEFF. DAVIS HWY. |
ARLINGTON, VA 22202 |
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