Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/24/1991
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Application #:
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07394095
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Filing Dt:
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08/15/1989
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Inventors:
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TORU UEKI, MASAJI YOSHIMURA, KAZUHARU KANEZAKI, TAKASHI SATOH, INEO IWATA, SUSUMU KISHI
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Title:
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MOLDING MATERIAL FOR ELECTROCONDUCTIVE IC PARTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| STUART J. FRIEDMAN |
| SIXBEY, FRIEDMAN, LEEDOM & FERGUSON, PC |
| SUITE 600 |
| 2010 CORPORATE RIDGE |
| MCLEAN, VA 22102 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2-5, KASUMIGASEKI 3-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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| BURNS, DOANE, SWECKER & MATHIS, L.L.P. |
| ROBERT G. MUKAI |
| P.O. BOX 1404 |
| ALEXANDRIA, VIRGINIA 22313-1404 |
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