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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/18/1992
Application #:
07583284
Filing Dt:
09/17/1990
Inventor:
DEBORAH D. L. CHUNG
Title:
CARBON FIBER REINFORCED TIN-LEAD ALLOY AS A LOW THERMAL EXPANSION SOLDER PREFORM
Assignment: 1
Reel/Frame:
005445/0501Recorded: 09/17/1990Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
08/28/1990
Assignee:
STATE UNIVERSITY PLAZA, A CORP. OF NY
ALBANY, NEW YORK 12246
Correspondent:
MICHAEL L. DUNN
DUNN & ASSOCIATES
P. O. BOX 96
NEWFANE, NY 14108
Assignment: 2
Reel/Frame:
005556/0029Recorded: 11/21/1990Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
11/05/1990
Assignee:
7-35 KITASHINAGAWA-6, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
HILL VAN SANTEN, STEADMAN & SIMPSON
70TH FLOOR SEARS TOWER
CHICAGO, IL 60606

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