Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
02/18/1992
|
Application #:
|
07583284
|
Filing Dt:
|
09/17/1990
|
Inventor:
|
DEBORAH D. L. CHUNG
|
Title:
|
CARBON FIBER REINFORCED TIN-LEAD ALLOY AS A LOW THERMAL EXPANSION SOLDER PREFORM
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST.
|
|
|
|
|
|
STATE UNIVERSITY PLAZA, A CORP. OF NY |
ALBANY, NEW YORK 12246 |
|
|
|
MICHAEL L. DUNN |
DUNN & ASSOCIATES |
P. O. BOX 96 |
NEWFANE, NY 14108 |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST.
|
|
|
|
|
|
7-35 KITASHINAGAWA-6, SHINAGAWA-KU |
TOKYO, JAPAN |
|
|
|
HILL VAN SANTEN, STEADMAN & SIMPSON |
70TH FLOOR SEARS TOWER |
CHICAGO, IL 60606 |
|
|
Search Results as of:
05/07/2024 11:47 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|