Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/25/1992
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Application #:
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07524434
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Filing Dt:
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05/17/1990
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Inventors:
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JUNICHI ASADA, KENJI TAKAHASHI, TOSHIHARU SAKURAI
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Title:
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METHOD OF SEALING SEMICONDUCTOR DEVICE WITH RESIN BY PRESSING A LEAD FRAME TO A HEAT SINK USING AN UPPER MOLD PRESSURE MEMBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI |
KANAGAWA-KEN, JAPAN |
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FOLEY & LARDNER, SCHWARTZ, JEFFERY, |
SCHWAAB, MACK, BLUMENTHAL & EVANS |
P. O. BOX 299 |
ALEXANDRIA, VA 22313-0299 |
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