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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/10/1992
Application #:
07669567
Filing Dt:
03/14/1991
Inventor:
NAGAO SHIMIZU
Title:
METHOD OF BONDING LEADS TO SEMICONDUCTOR ELEMENTS
Assignment: 1
Reel/Frame:
005713/0124Recorded: 05/16/1991Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
04/08/1991
Assignee:
4-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO-TO, JAPAN
Correspondent:
W. DOUGLAS CAROTHERS, JR.
GEN. PATENT COUNSEL
PAT. DEPT, S-MOS SYSTEMS, INC.
2460 NORTH FIRST ST.
SAN JOSE, CA 95131-1002

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