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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/07/1992
Application #:
07605357
Filing Dt:
10/30/1990
Inventors:
YASUKAZU MASE, MASAHIRO ABE, TOSHIHIKO KATSURA
Title:
MULTI-LAYERED WIRING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Assignment: 1
Reel/Frame:
005506/0392Recorded: 10/30/1990Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
10/24/1990
Exec Dt:
10/24/1990
Exec Dt:
10/24/1990
Assignee:
72 HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, A CORP OF JAPAN
JAPAN
Correspondent:
FINNEGAN, HENDERSON, FARABOW,
GARRETT & DUNNER
1300 I ST., N. W.,
WASHINGTON, DC 20005-3315
Assignment: 2
Reel/Frame:
010905/0377Recorded: 06/29/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Assignee:
1048 OAZA-KADOMA, KADOMA-SHI
OSAKA 571-8686, JAPAN
Correspondent:
ARENT FOX KINTNER PLOTKIN & KAHN, PLLC
DAVID T. NIKAIDO
1050 CONNECTICUT AVENUE N.W.
SUITE 600
WASHINGTON, DC 20036-5339

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