Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/02/1992
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Application #:
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07618031
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Filing Dt:
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11/26/1990
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Inventors:
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KENICHI FUSE, TAKAO FUKUNAGA, MASANAO KONO, HISAO IRIE
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Title:
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METHOD OF FORMING A SOLDER LAYER ON PADS OF A CIRCUIT BOARD AND METHOD OF MOUNTING AN ELECTRONIC PART ON A CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 6-1, 2-CHOME, MARUNOUCHI, CHIYODA-KU, |
| TOKYO,, JAPAN |
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| 671-4, MIZUASHI, NOGUCHI-CHO, KAKOGAWA, |
| HYOGO,, JAPAN 675 |
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| FRISHAUF, HOLTZ, GOODMAN & WOODWARD |
| 600 THIRD AVE., 30TH FLOOR |
| NEW YORK, NY 10016 |
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