Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/25/1992
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Application #:
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07707901
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Filing Dt:
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05/30/1991
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Inventor:
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YATSUHARU YOKOTA
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Title:
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REFLOW SOLDERING METHOD AND THE APPARATUS THEREOFF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 323-7 DAIRAKUJI-MACHI, HACHIOJI-SHI |
| TOKYO, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & |
| DUNNER |
| 1300 I ST., NW |
| WASHINGTON, DC 20005-3315 |
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