Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/1992
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Application #:
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07620734
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Filing Dt:
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12/03/1990
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Inventors:
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WEI KOH, WAYNE D. KUIPERS
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Title:
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METHOD FOR FORMING MULTILAYER INDIUM BUMP CONTACTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 1111 STEWART AVENUE |
| BETHPAGE,, NEW YORK 11714-3580 |
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| BRUCE B. BRUNDA |
| STETINA AND BRUNDA |
| 24221 CALLE DE LA LOUISA |
| STE. 401 |
| LAGUNA HILLS, CA 92653 |
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