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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/20/1992
Application #:
07767949
Filing Dt:
09/30/1991
Inventors:
TOM Y. CHI, BROOK D. RAYMOND
Title:
BONDING OF INTEGRATED CIRCUIT CHIP TO CARRIER USING GOLD/TIN EUTECTIC ALLOY AND REFRACTORY METAL BARRIER LAYER TO BLOCK MIGRATION OF TIN THROUGH VIA HOLES
Assignment: 1
Reel/Frame:
005868/0403Recorded: 09/30/1991Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
09/20/1991
Exec Dt:
09/20/1991
Assignee:
LOS ANGELES, CALIFORNIA
Correspondent:
JEANNETTE M. WALDER
HUGHES AIRCRAFT COMPANY
BLDG. C1, MAIL STATION A-126
P.O. BOX 45066
LOS ANGELES, CA 90045-0066

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