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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	5191512	Issue Dt:	03/02/1993	Application #:	07794149	Filing Dt:	11/21/1991
Inventors:	SHINICHI OGURA, HIROO ADACHI, OSAMU SHISHIDO, TETSUYA WATANABE, YUUICHI MINEO et al
Title:	HEAT SINK/CIRCUIT BOARD ASSEMBLY

Assignment: 1

Reel/Frame:

005992/0167

Recorded: 01/21/1992

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST.

Assignors:

OGURA, SHINICHI

Exec Dt:

12/28/1991

ADACHI, HIROO

Exec Dt:

12/28/1991

SHISHIDO, OSAMU

Exec Dt:

12/28/1991

WATANABE, TETSUYA

Exec Dt:

12/28/1991

MINEO, YUUICHI

Exec Dt:

12/28/1991

KAGEYAMA, TOHRU

Exec Dt:

12/28/1991

NISHIYAMA, YOICHI

Exec Dt:

12/28/1991

YAMAGUCHI, TAKASHI

Exec Dt:

12/28/1991

OGAWA, KEIICHI

Exec Dt:

12/28/1991

Assignee:

PIONEER ELECTRONIC CORPORATION

4-1, MEGURO 1-CHOME, MEGURO-KU, TOKYO, JAPAN

Correspondent:

FLEIT, JACOBSON, COHN, PRICE,

HOLMAN & STERN

THE JENIFER BLDG.

400 SEVENTH ST., NW

WASHINGTON, DC 20004

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