Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/09/1993
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Application #:
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07769432
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Filing Dt:
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10/02/1991
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Inventors:
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HIDEAKI KAWASHIMA, KOUHEI EGUCHI
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Title:
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DEVICE FOR SUPPORTING A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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6-3, OTEMACHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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SPENCER & FRANK |
1111 19TH ST., N.W. |
WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 3 LI HSIN ROAD 2 SCIENCE BASED INDUSTRIAL PARK |
HSIN CHU CITY, TAIWAN |
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CONNOLLY BOVE LODGE & HUTZ |
LARRY J. HUME |
SUITE 800 |
1990 M. STREET, N.W., |
WASHINGTON, D.C. 20036-3425 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI HSIN RD II |
HSIN-CHU CITY, 30077, TAIWAN R.O.C |
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RABIN & BERDO, P.C. |
STEVEN M. RABIN |
1101 14TH STREET, N.W., SUITE 500 |
WASHINGTON, DC 20005 |
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