Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/1993
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Application #:
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07693979
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Filing Dt:
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04/29/1991
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Inventors:
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KLAUS BEYER, EDWARD C. FREDERICKS, LOUIS LU-CHEN HSU, DAVID E. KOTECKI et al
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Title:
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SUB-LAYER CONTACT TECHNIQUE USING IN SITU DOPED AMORPHOUS SILICON AND SOLID PHASE RECRYSTALLIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| JEFFREY S. LABAW |
| IBM CORPORATION |
| FSD HQ-MAIL STOP 201 |
| 6600 ROCKLEDGE DR. |
| BETHESDA, MD 20817 |
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