Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/30/1993
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Application #:
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07792559
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Filing Dt:
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11/15/1991
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Inventors:
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AVISHAY KATZ, CHIEN-HSUN LEE, KING L. TAI, YIU-MAN WONG
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Title:
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BONDING METHOD USING SOLDER COMPOSED OF MULTIPLE ALTERNATING GOLD AND TIN LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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550 MADISON AVENUE, NEW YORK, NY 10022-3201 |
NEW YORK |
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P.V. D. WILDE |
AT&T BELL LABORATORIES |
600 MOUNTAIN AVE. |
P.O. BOX 636 |
MURRAY HILL, NJ 07974-0636 |
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Assignment:
2
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3003 TASMAN DR. |
LOAN DOCUMENTATION HA155 |
SANTA CLARA, CALIFORNIA 95054 |
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SILICON VALLEY BANK |
SHANNON HUBBARD |
LOAN DOCUMENTATION HA15 |
3003 TASMAN DR. |
SANTA CLARA, CA 95054 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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2805 NORTH DALLAS PKWY STE 400 |
PLANO, TEXAS 75093 |
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SILICON VALLEY BANK |
LOAN DOCUMENTATION HA 155 |
3003 TASMAN DR. |
SANTA CLARA, CA 95054 |
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