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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
04/06/1993
Application #:
07700287
Filing Dt:
05/15/1991
Inventor:
SHUICHI OKABE
Title:
MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARDS
Assignment: 1
Reel/Frame:
005764/0970Recorded: 07/01/1991Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
05/13/1991
Assignee:
ARMONK, NEW YORK 10504
Correspondent:
RICHARD M. GOLDMAN
IBM CORP.
INTELLECTUAL PROPERTY LAW
N50/251-2, 1701 NORTH ST.
ENDICOTT, NY 13760
Assignment: 2
Reel/Frame:
009570/0558Recorded: 11/09/1998Pages: 50
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/30/1998
Exec Dt:
10/30/1998
Exec Dt:
10/30/1998
Exec Dt:
10/30/1998
Exec Dt:
10/30/1998
Exec Dt:
10/30/1998
Exec Dt:
10/30/1998
Assignee:
200 JERICHO QUADRANGLE
JERICHO, NEW YORK 11753
Correspondent:
LORI E. LESSER, ESQ.
425 LEXINGTON AVENUE
NEW YORK, NY 10017
Assignment: 3
Reel/Frame:
010281/0795Recorded: 10/04/1999Pages: 56
Conveyance:
AMENDED AND RESTATED GUARANTEE AND COLLATERAL AGREEMENT
Assignor:
Exec Dt:
09/01/1999
Assignee:
200 JERICHO QUADRANGLE
JERICHO, NEW YORK 11753
Correspondent:
SIMPSON THACHER & BARTLETT
KRISTOPHER E. AHREND, ESQ.
425 LEXINGTON AVENUE
NEW YORK, NY 10017

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