Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/06/1993
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Application #:
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07450847
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Filing Dt:
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12/13/1989
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Inventor:
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MICHIO OSADA
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Title:
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METHOD OF AND DEVICE FOR SEAL MOLDING ELECTRONIC COMPONENTS WITH RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 122-2 MEKAWA, MAKISHIMA-CHO, UJI-SHI |
| KYOTO-FU, JAPAN |
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| W. G. FASSE |
| INDIAN POND LANE |
| P.O. BOX K |
| ST. ALBANS, ME 04971 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 122-2 MEKAWA MAKISHIMA-CHO, UJI-SHI |
| KYOTO, JAPAN |
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| W. G. FASSE |
| P.O. BOX K |
| ST. ALBANS, ME 04971 |
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