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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/06/1993
Application #:
07749932
Filing Dt:
08/26/1991
Inventor:
KENNETH T. SIENSKI
Title:
CONFIGURABLE MULTI-CHIP MODULE INTERCONNECT
Assignment: 1
Reel/Frame:
005821/0019Recorded: 08/26/1991Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
08/19/1991
Assignee:
P.O. BOX 660248
DALLAS, TEXAS 75226
Correspondent:
HAROLD E. MEIER
GARDERE & WYNNE
1601 ELM STREET
3000 THANKSGIVING TOWER
DALLAS, TX 75201

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