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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/01/1993
Application #:
07622592
Filing Dt:
12/05/1990
Inventor:
HIDEKI TAKADA
Title:
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING HIGH MATCHING DEGREE AND HIGH INTEGRATION DENSITY
Assignment: 1
Reel/Frame:
005537/0469Recorded: 12/05/1990Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
11/29/1990
Assignee:
72 HORIKAWA-CHO, SAIWAI-KU,
A CORP. OF JAPAN
KAWASAKI-SHI, JAPAN
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT &
DUNNER
1300 I ST., N.W.
WASHINGTON, DC 20005-3315

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