Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/08/1993
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Application #:
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07630113
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Filing Dt:
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12/19/1990
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Inventors:
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LOUIS LIANG, JON M. LONG
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Title:
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SEMICONDUCTOR DEVICE PACKAGE HAVING A THERMAL DISSIPATION MEANS THAT ALLOWS FOR LATERAL MOVEMENT OF THE LEAD FRAME WITH RESPECT TO THE HOUSING WITHOUT BREAKAGE OF THE THERMAL DISSIPATION PATH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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1109 MCKAY DRIVE |
SAN JOSE, CALIFORNIA 95131 |
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BRADLEY A. PERKINS |
VLSI TECHNOLOGY, INC. |
1109 MCKAY DRIVE |
SAN JOSE, CA 95131 |
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