Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/1993
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Application #:
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07871769
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Filing Dt:
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04/21/1992
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Inventor:
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TOMOAKI ISHIDA
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Title:
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DRY ETCHING METHOD OF COPPER OR COPPER ALLOY INTERCONNECTION LAYER EMPLOYING PLASMA OF AN IODINE COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 2-3 MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| STEPHEN A. BECKER |
| LOWE, PRICE, LEBLANC & BECKER |
| 99 CANAL CENTER PLAZA, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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