Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/07/1993
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Application #:
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07833448
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Filing Dt:
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02/06/1992
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Inventors:
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KENJI ISHII, TAKAMASA NAKAI, HIROYUKI MATSUMOTO, KENICHI MORIYAMA
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Title:
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PROCESS FOR PRODUCING THIN COPPER FOIL-CLAD CIRCUIT BOARD SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| SUGHRUE, MION, ZINN, MACPEAK & SEAS |
| ATTN: WADDELL A. BIGGART |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037-3202 |
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