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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/28/1993
Application #:
07922118
Filing Dt:
07/28/1992
Inventors:
MICHAEL D. ROSTOKER, TOM LEY
Title:
SEMICONDUCTOR DEVICE PACKAGE WITH SOLDER BUMP ELECTRICAL CONNECTIONS AN EXTERNAL SURFACE OF THE PACKAGE
Assignment: 1
Reel/Frame:
006230/0479Recorded: 07/28/1992Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
07/28/1992
Exec Dt:
07/28/1992
Assignee:
1551 MCCARTHY BLVD.
MILPITAS, CALIFORNIA 95035
Correspondent:
GERALD E. LINDEN
2261 PIMLICO ST.
ORLANDO, FL 32822

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