Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/19/1993
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Application #:
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07964457
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Filing Dt:
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10/21/1992
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Inventors:
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WHAN G. KIM, BYUNG W. LEE, JI Y. LEE
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Title:
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IMIDE EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR ELEMENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 105, CHIMSAN-DONG, BUK-KU |
| TAEGU-SI, 702-050, KOREA, REPUBLIC OF |
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| KRISTINE M. STRODTHOFF |
| MERCHANT, GOULD, ET AL. |
| 3100 NORWEST CENTER |
| 90 SOUTH SEVENTH STREET |
| MINNEAPOLIS, MN 55402 |
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