Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/02/1993
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Application #:
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08031324
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Filing Dt:
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03/15/1993
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Inventors:
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TAKESHI SUNADA, YASUKAZU MASE
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Title:
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METHOD OF FORMING MULTILAYERED WIRING STRUCTURE OF SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| MR. JOHN B. TURNER |
| FINNEGAN, HENDERSON, FARABOW, ET AL |
| 1300 I STREET, N.W. |
| WASHINGTON, DC 20005 |
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